TM11R-5M2 Series q Subminiature, LAN Modular Jack Connectors
B Recommended PCB mounting patterns
q With Built-in Optical Pipe
11.1
8.89
6.35
3.81
q Without Optical Pipe
8.89
1.27
LED location area
6.35
LED light emission area
3.81
1
Contact No.
1
1.27
No conductive traces
11.4 MAX
8-?1
No conductive traces
11.4 MAX
8- ?1
Contact No.
7 5 3 1
8 6 4 2
8
7
6
5
4
3
2
1
2-?1.6
2- ?2.4
Printed board edge
Connector front edge
11.4
14.75
2
No conductive &
ground traces
11.4 MIN
18.1MIN
2- ?1.6
2-?2.4
Printed board
edge
11.4
14.75
2
No conductive &
ground traces
11.4 MIN
18.1 MIN
Connector
front edge
LED light emitting center
2.7 MAX
4
Suggested LEDs
1.5 MAX
* Recommendations for PCB Design
1 Areas indicated should be free of conductive traces.
2 Area indicated should be free of conductive & ground traces.
3 Recommended board thickness: 1.6mm.
4
To assure that the indicator light pipes operates correctly the LED’s must be installed directly on the PCB, within
recommended dimensions and with light emitting center in upward direction.
Contact applicable manufacturer for LED specification.
B Panel Cutout
q For Both Types, With and Without Built-in Optical Pipe
(33)
Lock lever
3±1 1
15.4
TM21P--88P
1
4.5MIN
PCB mounting surface
2 -0.7
Panel side
* Recommendations for Panel Design
1
Connector front surface
1
0
5.55
3.1MAX
1 The shield contacts should connect with the panel cut-out on all sides.
Note: IPA cleaning at room temperature is recommended for the cleaning of this product.
When an aqueous cleaning agent is to be used, there is a concern that the light pipe (made of polycarbonate
resin) may change color; therefore, please make a selection based on a table showing the effects on the resin.
These tables are issued by the various manufacturers of cleaning agents.
4
相关PDF资料
TM21R-5B-3232D-LP CONN JACK MODULAR 8X8-8 GANGED
TMC-6 SURGE SUPPR 6OUT 6'CORD
TMDSEMU100V2U-ARM XDS100 USB JTAG EMULATOR
TMDSEVM355 TMDSEVM355
TMDX5535EZDSP KIT DEV EZDSP USB STICK C5535
TMDXEVM5515 EVAL MODULE DSP FOR C55XX
TMDXEXP1808L KIT EXPERIMENTER FOR AM180X
TO263-3EV-VREG BOARD EVAL TO220-3/TO263-3 VREG
相关代理商/技术参数
TM11R-5M2-88-LP(02) 功能描述:以太网和电信连接器 8-8P PCB R/A JACK RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级:
TM11R-5M2-88-LP(30) 功能描述:以太网和电信连接器 8P F SUB MODULAR R/A BUILT IN OPTICAL T/H RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级:
TM11R-5M3-88 功能描述:以太网和电信连接器 RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级:
TM11R-5M3-88-LP 功能描述:以太网和电信连接器 RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级:
TM11R-5N2-88 功能描述:以太网和电信连接器 8P F MODULAR PLG EMI BRD MNT THROUGH HOLE RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级:
TM11R-5N2-88(50) 功能描述:以太网和电信连接器 10P F MODULR PLG EMI R/A GANGED TYPE T/H RoHS:否 制造商:Pulse 产品:Modular Jacks 性能类别: USOC 代码:RJ45 位置/触点数量: 安装风格:Through Hole 端口数量:1 x 1 型式:Female 屏蔽: 电流额定值: 电压额定值: 触点电镀: 外壳材料:Thermoplastic IP 等级:
TM11R-88-35S-300 功能描述:CONN 8-8 MOD JACK W/LEADS 12INCH RoHS:是 类别:电缆组件 >> 模块 系列:TM-W 标准包装:1 系列:- 缆线类型:圆形线缆 连接器类型:插头至插头 安装类型:自由悬挂 位置/触点数:8p8c(RJ45,以太网) 长度:10.0'(3.05m) 屏蔽:屏蔽 颜色:灰 特点:模制插头 样式:Cat5e
TM11R-88-35S-300M 制造商:Hirose 功能描述: